Numerical analysis on the thermal performance of microchannel heat sinks with Al2O3 nanofluid and various fins

The hydraulic and thermal performance of microchannel heat sink configurations for high performance electronic cooling applications is investigated by numerical modelling. Conjugate heat transfer simulations are obtained through the silicon walls and the fluid domain of a square base prism heat sink traversed by 50 parallel rectangular cooling ducts, under a 150 W/cm² constant heat flux input through the base. Al₂O₃ nanofluid coolant with a nanoparticle volume fraction ranging from 0 to 3% is supplied at 298 K, over the Reynolds number range 100 to 350, modelled as a single-phase homogeneous medium. Rectangular, twisted, and zig-zag fins are inserted into the plain rectangular duct to enhance the heat transfer rate. The zig-zag fin and 3% Al₂O₃ nanofluid provide the best thermal performance, with a 6.44 K lower average heated wall contact temperature, 60% higher Nusselt number, and 15% higher second law efficiency than without fins and plain water cooling. Twist in the microchannel fin unexpectedly reduced the microchannel pressure drop by 2% to 15% compared to a straight fin, possibly due to the more evenly distributed axial mass flux across the microchannel.