Bilayered Distribution
of Ag and Fe3O4 in Electrospun TPU Films for
Low-Reflection Electromagnetic
Interference Shielding and Multiple Thermal Management Functionalities
posted on 2023-12-20, 14:41authored byYang Zhang, Xiran Tang, Huan Li, Zhiheng Zhao, Yang Pan, Lingtong Li, Hong Wu, Shaoyun Guo
Low-reflection electromagnetic interference (EMI) shielding
composites
are crucial to next-generation electronic equipment. Moreover, it
is highly desirable to integrate thermal management performance into
the composites to broaden their applications. Herein, a bilayered
EMI shielding composite film with thermal management performances
was fabricated successfully via electrospinning, in situ growth, and
hot-pressing approaches. Fe3O4 particles are
distributed in the upper layer for EM wave absorption and photothermal
conversion, while Ag particles are distributed in the lower layer
for EMI shielding, thermal conduction, and electrothermal conversion.
The resultant film achieved a remarkable EMI shielding effectiveness
of 98.2 dB with an average reflection coefficient value as low as
0.64. Subsequently, the composite film showed an optimum in-plane
thermal conductivity of 6.49 W/(m·K), due to the three-dimensional
(3D) interconnected network of Ag particles. In addition, the upper
layer of the composite film exhibited admirable photothermal conversion
performance, reaching a saturated temperature of 91.3 °C (1 sun).
Meanwhile, the lower layer of the composite film showed favorable
electrothermal conversion performance, contributing to a high saturated
temperature of 92.6 °C (6 V). This work would propose one novel
strategy for developing low-reflection EMI shielding composite films
integrated with multiple thermal management functionalities in microelectronic
systems.