am300603x_si_001.pdf (701.91 kB)
Nanoscale Rings from Silicon-Containing Triblock Terpolymers
journal contribution
posted on 2012-07-25, 00:00 authored by Marc D. Rodwogin, A. Baruth, Elizabeth A. Jackson, C. Leighton, Marc A. HillmyerNanoscopic ring arrays of various materials show promise
for both
technological applications and fundamental studies. In this work we
report the preparation of sub-50 nm diameter ring arrays from metallic
thin films using a block polymer lithographic pattern transfer approach.
We prepared a triblock terpolymer that adopts a core–shell
cylindrical morphology where the shell is an oxidizable polydimethylsiloxane
block. Solvent annealed thin films of this terpolymer produce cylindrical
features oriented perpendicular to the substrate surface. The polydimethylsiloxane
shell is then converted into SiOx rings
by an oxygen reactive ion etch. The resultant hard mask pattern is
then transferred into Au, Ni80Fe20, and Ni80Cr20 thin films via Ar ion beam milling, demonstrating
the generality of the approach.