Interplay between Structural and Dielectric Features of New Low k Hybrid Organic–Organometallic Supramolecular Ribbons
2016-02-22T10:14:36Z (GMT) by
The synthesis and characterization of low k one-dimensional (1D) hybrid organic–organometallic supramolecular ribbons <b>3a</b>,<b>b</b>, through halogen-bond driven co-crystallization of <i>trans</i>-[Pt(PCy<sub>3</sub>)<sub>2</sub>(CC-4-py)<sub>2</sub>] (<b>1</b>) with 1,4-diiodotetrafluorobenzene (<b>2a</b>) and <i>trans</i>-1,2-bis-(2,3,5,6-tetrafluoro-4-iodophenyl)-ethylene (<b>2b</b>), are reported. The co-crystals <b>3a</b>,<b>b</b> have been obtained by isothermal evaporation of a chloroform solution containing the corresponding starting materials at room temperature. X-ray structure determinations show that noncovalent interactions other than halogen bonds help in the construction of the crystal packing; these interactions are stronger in <b>3b</b>, thus reducing the chain mobility with respect to <b>3a</b>. Accordingly, the broadband dielectric spectroscopic determinations, carried out from 10<sup>–2</sup> to 10<sup>7</sup> Hz and at a temperature ranging from 25 to 155 °C, showed that both <b>3a</b> and <b>3b</b> materials exhibit a real component of dielectric permittivity (ε′) significantly lower than SiO<sub>2</sub>. In particular in the case of <b>3b</b>, the rigidity of the 1D chain explains the observed ε″ and tan δ values. A permittivity value that is significantly lower than that of the silica reference, tan δ values lower than 0.02 in the entire investigated temperature range, and less than 0.004 at <i>T</i> < 100 °C make <b>3b</b> a very promising low k hybrid organic–organometallic material for application as dielectric films in next generation microelectronics.