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Download fileSolvent-Engineered Stress in Nanoscale Materials
journal contribution
posted on 2018-11-21, 00:00 authored by Shaun Mills, Chiara Rotella, Eoin K. McCarthy, David J. Hill, Jing-Jing Wang, John F. Donegan, James F. Cahoon, John E. Sader, John J. BolandNanoscale
materials
are frequently coated with surface stabilization
layers during growth that prevent flocculation in solution and facilitate
processing technologies such as ink-jet device printing. Here, we
show that few-nanometer-thick stabilization layers typically used
swell in the presence of certain solvents and impart significant stresses
to the nanomaterial that remains even after the solvent has evaporated.
Solvent swelling of the surface layer dramatically enhances nanomaterial–substrate
adhesion via the collapse of the stabilization layer during solvent
evaporation, preventing stress relaxation. We demonstrate the stress
modulation of Ag, Au, and Si nanowires functionalised with surface
polymers and surfactant layers and detect strain levels between 0.1
and 0.6% using atomic force microscopy mechanical measurement and
Raman spectroscopy. Dry-transferred nanowires exhibit poor adhesion
and show no evidence of incorporated stress but become stressed immediately
following solvent exposure. Strain engineering is demonstrated by
coating nanowires with few-nanometer-thick solvent-responsive polymer
layers.
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Keywords
Raman spectroscopyDry-transferred nanowires exhibitsurfactant layerssurface stabilization layersprocessing technologiesNanoscale Materials Nanoscale materialsforce microscopystress modulationstrain levelsfew-nanometer-thick solvent-responsive polymer layersfew-nanometer-thick stabilization layerssurface polymersStrain engineeringstress relaxationdevice printingsurface layercoating nanowiresSi nanowires functionalisedstabilization layerSolvent-Engineered Stress