Decreasing Interface Defect Densities via Silicon Oxide Passivation at Temperatures Below 450 °C

Low-temperature (LT) passivation methods (<450 °C) for decreasing defect densities in the material combination of silica (SiO_x) and silicon (Si) are relevant to develop diverse technologies (e.g., electronics, photonics, medicine), where defects of SiO_x/Si cause losses and malfunctions. Many device structures contain the SiO_x/Si interface(s), of which defect densities cannot be decreased by the traditional, beneficial high temperature treatment (>700 °C). Therefore, the LT passivation of SiO_x/Si has long been a research topic to improve application performance. Here, we demonstrate that an LT (<450 °C) ultrahigh-vacuum (UHV) treatment is a potential method that can be combined with current state-of-the-art processes in a scalable way, to decrease the defect densities at the SiO_x/Si interfaces. The studied LT-UHV approach includes a combination of wet chemistry followed by UHV-based heating and preoxidation of silicon surfaces. The controlled oxidation during the LT-UHV treatment is found to provide an until now unreported crystalline Si oxide phase. This crystalline SiO_x phase can explain the observed decrease in the defect density by half. Furthermore, the LT-UHV treatment can be applied in a complementary, post-treatment way to ready components to decrease electrical losses. The LT-UHV treatment has been found to decrease the detector leakage current by a factor of 2.