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Electrical conductive, characteristics of ACA bonding: a review of the literature, current challenges and future prospects.

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conference contribution
posted on 11.02.2009, 09:58 by Guangbin Dou, David C. Whalley, Changqing Liu
Anisotropic Conductive Adhesives (ACAs) have been used in fine pitch electronics packaging for over a decade and provide a high density and low temperature bonding method in a range of niche applications. The principal objective of this paper is to provide significant insights into the basic conductive characteristics of ACAs based on a review of previously reported scientific research, and to identify the current challenges and future prospects for this technology. In order to provide a concise, structured overview of this topic, many detailed conductive models, mathematical solutions and research methodologies are presented based on the reviewed literature. These models can partially explain the conductive mechanisms of an ACA particle, but make a number of important sirnplifying assumptions. However, one model was developed and can be used to explain the conductive mechanism of an ACA particle more successfully. In conclusion, existing computational models, mathematical models and physical models have been used to estimate the resistance of an ACA particle and the particle contact area, and therefore constriction resistance, for a given degree of particle deformation, thereby almost achieving a model for the whole resistance of an ACA joint. The paper will close by identifying other research challenges remaining for this important electronics interconnection technology.

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Citation

DOU, G., WHALLEY, D.C. and LIU, C., 2004. Electrical conductive, characteristics of ACA bonding: a review of the literature, current challenges and future prospects. IN: Proceeding of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, (HDP '04). 30 June-3 July, Shanghai, China, pp. 264-276.

Publisher

© IEEE

Version

VoR (Version of Record)

Publication date

2004

Notes

This is a conference paper [© IEEE]. It is also available at: http://ieeexplore.ieee.org/ Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.

ISBN

0780386213

Language

en

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