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Postpolymerization of Functional Organosiloxanes: An Efficient Strategy for Preparation of Low‑k Material with Enhanced Thermostability and Mechanical Properties
journal contribution
posted on 2014-09-23, 00:00 authored by Chao Yuan, Jiajia Wang, Kaikai Jin, Shen Diao, Jing Sun, Jiawei Tong, Qiang FangA novel functional oligomer (Si-TFVE) with
a siloxane
backbone and thermally cross-linkable trifluorovinyl ether groups
(−OCFCF2) is reported here. When postpolymerized
at high temperature, Si-TFVE converts to an amorphous
cross-linked network (Si-PFCB), which shows a dielectric
constant of 2.33 and dielectric loss below 2.1 × 10–3 at 30 MHz. Si-PFCB also shows excellent film uniformity
with the surface roughness less than 5.79 nm over a 1 μm square
area. Moreover, Si-PFCB shows high thermostability with
a 5 wt % loss temperature of 472 °C and no obvious Tg below 350 °C. In regard to the mechanical properties, Si-PFCB has Young’s modulus, hardness, and bonding
strength with silicon wafer surface of 10.06 GPa, 0.392, and 4.93
GPa, respectively. These results suggest that such oligomer is suitable
for utilization in ultralarge scale integration circuits. In addition,
this contribution provides a new route to prepare cross-linked organosiloxanes
only by heating instead of using catalysts or initiators in the traditional
procedures.
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postpolymerizedMechanical PropertiesA novelutilizationEnhanced Thermostability4.93 GPasilicon wafer surface1 μ m square areadielectric lossOCFmodulu2.33MaterialPostpolymerizationwtconvertheating5.79 nmthermostabilityYoungether30 MHzfilm uniformitysiloxane backboneregardPreparationhardnessEfficient Strategyproceduresurface roughnesstrifluorovinylultralarge scale integration circuitsorganosiloxaneTg2.1strengtholigomer10.06 GPaFunctional Organosiloxanescontributioninitiatorcatalyst
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