Rigiflex, Spontaneously Wettable Polymeric Mold for Forming Reversibly Bonded Nanocapillaries Pilnam Kim Kahp Y. Suh 10.1021/la0633942.s002 https://acs.figshare.com/articles/journal_contribution/Rigiflex_Spontaneously_Wettable_Polymeric_Mold_for_Forming_Reversibly_Bonded_Nanocapillaries/3013900 We present a novel ultraviolet (UV)-curable mold that enables the formation of reversibly bonded nanocapillaries (500−50 nm) on a gold or silicon substrate. A sheet-type (∼50 μm) polyethylene diacrylate (PEG-DA) mold was used for its rigiflex nature; it provides rigidity high enough for maintaining nanostructures (elastic modulus >70 MPa) and also flexibility good enough for intimate contact over a large area aided by weak electrostatic forces (zeta potential ≈ −113.55 mW). The electrostatic charge is generated on a rigiflex PEG-DA mold upon peeling from an original engraved silicon master by mechanical friction, thereby assisting the formation of spontaneous contact with the gold or silicon substrate. 2007-04-10 00:00:00 mold silicon substrate Spontaneously Wettable Polymeric Mold formation UV contact rigiflex Forming Reversibly Bonded NanocapillariesWe