Rigiflex, Spontaneously Wettable Polymeric Mold for Forming
Reversibly Bonded Nanocapillaries
Pilnam Kim
Kahp Y. Suh
10.1021/la0633942.s002
https://acs.figshare.com/articles/journal_contribution/Rigiflex_Spontaneously_Wettable_Polymeric_Mold_for_Forming_Reversibly_Bonded_Nanocapillaries/3013900
We present a novel ultraviolet (UV)-curable mold that enables the formation of reversibly bonded nanocapillaries
(500−50 nm) on a gold or silicon substrate. A sheet-type (∼50 μm) polyethylene diacrylate (PEG-DA) mold was
used for its rigiflex nature; it provides rigidity high enough for maintaining nanostructures (elastic modulus >70 MPa)
and also flexibility good enough for intimate contact over a large area aided by weak electrostatic forces (zeta potential
≈ −113.55 mW). The electrostatic charge is generated on a rigiflex PEG-DA mold upon peeling from an original
engraved silicon master by mechanical friction, thereby assisting the formation of spontaneous contact with the gold
or silicon substrate.
2007-04-10 00:00:00
mold
silicon substrate
Spontaneously Wettable Polymeric Mold
formation
UV
contact
rigiflex
Forming Reversibly Bonded NanocapillariesWe