10.6084/m9.figshare.1396602.v3
Linmiao Zhang
Linmiao
Zhang
Kaibo Wang
Kaibo
Wang
Nan Chen
Nan
Chen
Monitoring wafers’ geometric quality using an additive Gaussian process model
Taylor & Francis Group
2015
manufacturing process
agp
wafer
process model ABSTRACTThe
2015-11-17 14:06:30
Journal contribution
https://tandf.figshare.com/articles/journal_contribution/Monitoring_wafers_8217_geometric_quality_using_an_additive_Gaussian_process_model/1396602
<div><p>ABSTRACT</p><p>The geometric quality of a wafer is an important quality characteristic in the semiconductor industry. However, it is difficult to monitor this characteristic during the manufacturing process due to the challenges created by the complexity of the data structure. In this article, we propose an Additive Gaussian Process (AGP) model to approximate a standard geometric profile of a wafer while quantifying the deviations from the standard when a manufacturing process is in an in-control state. Based on the AGP model, two statistical tests are developed to determine whether or not a newly produced wafer is conforming. We have conducted extensive numerical simulations and real case studies, the results of which indicate that our proposed method is effective and has potentially wide application.</p></div>