PCB Project: Measuring Package Bond-Out Inductance via Ground Bounce

Roberson, Kylan

doi:10.6084/m9.figshare.1120447.v1

PCB Project: Measuring Package Bond-Out Inductance via Ground Bounce

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posted on 2014-07-29, 04:14 authored by Kylan RobersonKylan Roberson

In this experiment I looked into a way of measuring the ground bounce generated by capacitively loading 5 outputs of a Texas Instrument small outline package Hex-Flip Flop chip and discharging them all simultaneously.

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ground bounce bond-out inductance high-speed digital Computer Engineering

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CC BY 4.0

PCB Project: Measuring Package Bond-Out Inductance via Ground Bounce

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